“Starting in 2004, I had the opportunity to collaborate with Mr. Stelzl on a customer project in the field of Wafer Level Packaging. In this project, he designed, developed, and implemented the entire measurement technology for both the R&D production at our facility in Berlin and the mass production in Singapore. Through his ability to combine innovative and complex technologies, he created measurement systems that provided significantly more process feedback than would have been possible with established systems.”
Dr. Michael Töpper
Business Field Developer, Fraunhofer Institute for Reliability and Microintegration IZM